MAGNACHIP SEMICONDUCTOR Corp
Filing Type: S-4
Filing Date: 20050621
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FORM S-4
S-4
BUSINESS TRANSFER AGREEMENT
EX-2.1
FIRST AMENDMENT TO BUSINESS TRANSFER AGREEMENT
EX-2.2
CERTIFICATE OF FORMATION OF MAGNACHIP SEMICONDUCTOR LLC
EX-3.1
CERTIFICATE OF AMENDMENT TO CERTIFICATE OF FORMATION OF MAGNACHIP SEMICONDUCTOR
EX-3.2
THIRD AMENDED AND RESTATED LIMITED LIABILITY COMPANY OPERATING AGREEMENT
EX-3.3
ARTICLES OF INCORPORATION OF MAGNACHIP SEMICONDUCTOR S.A.
EX-3.4
CERTIFICATE OF INCORPORATION OF MAGNACHIP SEMICONDUCTOR FINANCE COMPANY
EX-3.5
BYLAWS OF MAGNACHIP SEMICONDUCTOR FINANCE COMPANY
EX-3.6
CERTIFICATE OF FORMATION FOR MAGNACHIP SEMICONDUCTOR SA HOLDINGS LLC
EX-3.7
LIMITED LIABILITY COMPANY AGREEMENT OF MAGNACHIP SEMICONDUCTOR SA HOLDINGS LLC
EX-3.8
ARTICLES OF ASSOCIATION OF MAGNACHIP SEMICONDUCTOR B.V.
EX-3.9
CERTIFICATE OF INCORPORATION OF MAGNACHIP SEMICONDUCTOR, INC. (USA)
EX-3.10
BYLAWS OF MAGNACHIP SEMICONDUCTOR, INC. (USA)
EX-3.11
ARTICLES OF INCORPORATION OF MAGNACHIP SEMICONDUCTOR, LTD. (KOREA)
EX-3.12
ARTICLES OF INCORPORATION OF MAGNACHIP SEMICONDUCTOR INC. (JAPAN)
EX-3.13
MEMORANDUM OF ASSOCIATION OF MAGNACHIP SEMICONDUCTOR LTD. (HONG KONG)
EX-3.14
ARTICLES OF ASSOCIATION OF MAGNACHIP SEMICONDUCTOR LTD. (HONG KONG)
EX-3.15
MEMORANDUM OF ASSOCIATION OF MAGNACHIP SEMICONDUCTOR LTD. (UNITED KINGDOM)
EX-3.16
ARTICLES OF ASSOCIATION OF MAGNACHIP SEMICONDUCTOR LTD. (UNITED KINGDOM)
EX-3.17
ARTICLES OF INCORPORATION OF MAGNACHIP SEMICONDUCTOR LTD. (TAIWAN)
EX-3.18
ARTICLES OF INCORPORATION OF ISRON CORPORATION
EX-3.19
ARTICLES OF INCORPORATION OF IC MEDIA CORPORATION
EX-3.20
BYLAWS OF IC MEDIA CORPORATION
EX-3.21
CERTIFICATE OF AMENDMENT TO BYLAWS OF IC MEDIA CORPORATION
EX-3.22
CERTIFICATE OF AMENDMENT TO BYLAWS OF IC MEDIA CORPORATION
EX-3.23
MEMORANDUM OF ASSOCIATION OF IC MEDIA INTERNATIONAL CORPORATION
EX-3.24
ARTICLES OF ASSOCIATION OF IC MEDIA INTERNATIONAL CORPORATION
EX-3.25
MEMORANDUM OF ASSOCIATION OF IC MEDIA HOLDING COMPANY LTD.
EX-3.26
ARTICLES OF ASSOCIATION OF IC MEDIA HOLDING COMPANY LTD.
EX-3.27
ARTICLES OF INCORPORATION OF IC MEDIA TECHOLOGY CORPORATION
EX-3.28
INDENTURE DATED AS OF DECEMBER 23, 2004
EX-4.1
REGISTRATION RIGHTS AGREEMENT DATED AS OF DECEMBER 23, 2004
EX-4.4
INDENTURE DATED AS OF DECEMBER 23, 2004
EX-4.5
REGISTRATION RIGHTS AGREEMENT DATED AS OF DECEMBER 23, 2004
EX-4.7
PURCHASE AGREEMENT DATED AS OF DECEMBER 23, 2004
EX-10.1
CREDIT AGREEMENT DATED AS OF DECEMBER 23, 2004
EX-10.2
FIRST AMENDMENT AND WAIVER TO CREDIT AGREEMENT
EX-10.3.A
SECOND AMENDMENT AND WAIVER TO CREDIT AGREEMENT
EX-10.3.B
INTERCREDITOR AGREEMENT DATED AS OF DECEMBER 23, 2004
EX-10.4
SECOND AMENDED AND RESTATED SECURITYHOLDERS' AGREEMENT
EX-10.5
WARRANT HELD BY HYNIX SEMICONDUCTOR INC.
EX-10.6
INTELLECTUAL PROPERTY LICENSE AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.7
TRADEMARK LICENSE AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.8
BUILDING LEASE AGREEMENT FOR WAREHOUSES DATED AS OF OCTOBER 6, 2004
EX-10.9
BUILDING LEASE AGREEMENT FOR M4 BUILDING DATED AS OF OCTOBER 6, 2004
EX-10.10
BUILDING LEASE AGREEMENT FOR R, C1 AND C2 BUILDINGS DATED AS OF OCTOBER 6, 2004
EX-10.11
LAND LEASE AND EASEMENT AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.12
WAFER FOUNDRY SERVICE AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.13
WAFER MASK PRODUCTION AND SUPPLY AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.14
GENERAL SERVICE SUPPLY AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.15
IT & FA SERVICE AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.16
SERVICE AGREEMENT DATED AS OF OCTOBER 6, 2004
EX-10.17
SERVICE AGREEMENT BETWEEN MAGNACHIP SEMICONDUCTOR LTD. AND JERRY BAKER
EX-10.18
SERVICE AGREEMENT BETWEEN MAGNACHIP SEMICONDUCTOR LTD. AND ROBERT KRAKAUER
EX-10.19
SERVICE AGREEMENT BETWEEN MAGNACHIP SEMICONDUCTOR LTD. AND VICTORIA MILLER NAM
EX-10.20
SERVICE AGREEMENT BETWEEN MAGNACHIP SEMICONDUCTOR LTD. AND TAE YOUNG HWANG
EX-10.21
SERVICE AGREEMENT BETWEEN MAGNACHIP SEMICONDUCTOR LTD. AND JASON HARTLOVE
EX-10.22
SERVICE AGREEMENT BETWEEN MAGNACHIP SEMICONDUCTOR LTD. AND DALE LINDLY
EX-10.23
MAGNACHIP LLC EQUITY INCENTIVE PLAN
EX-10.24
MAGNACHIP LLC CALIFORNIA EQUITY INCENTIVE PLAN
EX-10.25
R EQUIPMENT UTILIZATION AGREEMENT, DATED OCTOBER 6, 2004-HYNIX AND MAGNACHIP
EX-10.26
LICENSE AGREEMENT(MODULARBCD) DATED MAR. 18, 2005-ADVANCED ANALOGIC TECHNOLOGIES
EX-10.27
LICENSE AGREEMENT(TRENCHDMOS) DATED MAR. 18, 2005-ADVANCED ANALOGIC TECHNOLOGIES
EX-10.28
RFID DEVELOPMENT AND LICENSING AGREEMENT, DATED MAR 29, 2005-CELIS SEMICONDUCTOR
EX-10.29
TECHNOLOGY LICENSE AGREEMENT, DATED JULY 2001 - ARM LIMITED
EX-10.30
TECHNOLOGY LICENSE AGREEMENT, DATED DECEMBER 16, 1996-ADVANCED RISC MACHINES
EX-10.31
ARM7201TDSP DEVICE LICENSE AGREEMENT, DATED AUG. 26, 1997-ADVANCED RISC MACHINES
EX-10.32
TECHNOLOGY LICENSE AGREEMENT, DATED AUGUST 22, 2001-ARM LIMITED
EX-10.33
TECHNOLOGY LICENSE AGREEMENT, DATED MAY 20, 2004-ARM LIMITED
EX-10.34
COMPUTATION OF RATIO OF EARNINGS TO FIXED CHARGES
EX-12.1
SUBSIDIARIES OF MAGNACHIP SEMICONDUCTOR LLC
EX-21.1
CONSENT OF SAMIL PRICEWATERHOUSECOOPERS
EX-23.1
FORM T-1 6 7/8% SECOND PRIORITY SENIOR SECURED NOTES DUE 2011
EX-25.1
FORM T-1 8% SENIOR SUBORDINATED NOTES DUE 2014
EX-25.2
FORM OF LETTER OF TRANSMITTAL
EX-99.1
FORM OF NOTICE OF GUARANTEED DELIVERY
EX-99.2
FORM OF LETTER TO HOLDERS
EX-99.3
FORM OF LETTER TO BROKERS, DEALERS AND OTHER NOMINEES
EX-99.4
FORM OF LETTER TO CLIENTS
EX-99.5